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OSGi Organization Experiences 45% Growth in Membership in First Quarter 2000
19 New Members Join Consortium Developing Open Standard for Service Gateways
San Ramon, Calif. - (April 21, 2000) - The Open Services Gateway Initiative (OSGi) today announced that its membership grew by 45 percent in the first quarter of 2000, with 19 companies joining the organization. OSGi (http://www.osgi.org) is now comprised of 58 leading technology companies working to define and promote open standards for the delivery of multiple services over wide-area networks to local networks and devices. Member companies plan to gather for the OSGi annual member meeting, May 1-3 in San Diego, to finalize the initial release of the OSGi technical specification.
Cogency merges with Power Trunk
New company will accelerate time to market for power line semiconductor chipsets
Toronto, April 18, 2000 -- Cogency Technology Inc. announced today that it has undertaken a merger with Power Trunk Corporation of Ottawa, Canada. The new fabless semiconductor company will focus immediately on the development of chipsets for powerline networking, and will further leverage its skills in OFDM technology to address other emerging markets such as broadband wireless.
The new company, named Cogency Semiconductor Inc., will be headquartered in Toronto with an office in Ottawa.
Advanced Buildings Technologies & Practices has a new web site
A building professional's guide to more than 60 environmentally-appropriate technologies and practices. Architects, engineers and buildings managers can improve the energy and resource efficiency of commercial, industrial and multi-unit residential buildings through the use of the technologies and practices described in this web site. The following design and construction issues are covered:
This web site is offered as an assistance to building designers and the inclusion of technologies does not indicate its endorsement by the sponsors.
International Paper and Motorola Introduce ‘Smart Packaging’
Marriage of paper and electronics enables manufacturers and retailers to “talk to” their products throughout the supply chain, boosting efficiency while slashing losses from theft, counterfeiting, and error
PURCHASE, N.Y./SCHAUMBURG, Ill. (April 13, 2000) -- International Paper (NYSE:IP) and Motorola, Inc. (NYSE:MOT) announced today that they have signed a memorandum of understanding (MOU) in anticipation of manufacturing "smart packages.” These will contain smart tags that, when embedded into packaging, will have the ability to enable manufacturers, distributors and retailers to “talk to” their products throughout the supply chain, enhancing inventory control and security and helping to slash billions of dollars in losses annually from theft and counterfeiting.
The packaging breakthrough uses Motorola’s new BiStatix™ radio frequency identification (RFID) technology that combines silicon with printed ink. The new paper-based solution will contain information stored in small computer chips that can be read and modified through a wireless interface, making the smart packages an ideal tool for the identification, tracking and efficient routing of consumer products. The expectation of Motorola’s BiStatix RFID technology is to go beyond the capabilities of the inherently passive bar codes used in packaging today. The current system, known as the Universal Product Code (UPC), enables manufacturers and retailers to track their inventories by scanning them manually. In contrast, "smart tags" emit radio signals that allow companies and stores to "communicate" with their packaged products continuously, affordably and in real-time as they go from factories to retail shelves to checkout counters.
More information on Motorola’s Worldwide Smartcard Solutions Division can be found at www.motorola.com/smartcard
Invensys and Oxford University unveil breakthrough sensor technology
Invensys plc announced that its new partnership with Oxford University, the Invensys University Technology Centre (IUTC), has achieved major breakthroughs in electronic sensor validation technology.
The co-operative programme between the Invensys Intelligent Automation division and Oxford University’s Department of Engineering Science is focused on developing products for process measurement and control applications, particularly the emerging field of sensor self validation.
For more information visit www.invensys.com
PersonalGenie Brings Its Vision of the Networked Home to CONNECTIONS? 2000 as a Platinum Sponsor
Dallas, TX - Parks Associates and CABA (the Continental Automated Buildings Association) welcome PersonalGenie as a Platinum Sponsor at CONNECTIONS 2000: Advancing the Networked Home. This event gives the 500+ delegates who are attending CONNECTIONS on May 3-5, 2000, in San Diego, CA, a unique opportunity to see PersonalGenie's solutions for the connected home.
CONNECTIONS is the premier event for companies making and using residential gateways and home networks to promote new applications and services in North American Homes.
PersonalGenie is an Application Service Provider offering turnkey personalization solutions for smart devices, Internet portals, and e-commerce. Using their Digital Portrait? technology, consumers create portraits of themselves, describing their personality and interests. PersonalGenie uses similar technology to automatically create Digital Portraits of their clients' products and services, and then uses the portraits to match products and services to consumers' needs. PersonalGenie' s Digital Portrait technology is unique because the portraits are intelligent and adaptive, becoming more accurate over time. Companies that use PersonalGenie's technology enjoy a competitive advantage in offering their customers more choice, more convenience, and more personalized service.
For more information about Parks Associates or CABA, visit www.parksassociates.com or www.caba.org. For more information about PersonalGenie, visit www.personalgenie.com.
Invensys Joins Microsoft to develop open protocol solutions
Invensys has signed an agreement with Microsoft Corp. to participate in the development of standards that will interconnect home appliances and other consumer and commercial devices. The agreement expands the Universal Plug and Play Forum (UPnP) to include Invensys, the world leader in residential and commercial building and appliance automation, with other industry leaders, including General Electric Appliance, Sony, Intel and IBM.
For more information visit www.invensys.com
"Web Energy Sourcing: Silicon Energy"
Read Paul Doherty's latest report on the impact of technology on the design and construction industry on the Buzzsaw web site. www.buzzsaw.com/content/news/index.html
Realcomm - the Commercial Real Estate Technology and E-Commerce Conference in Dallas, June 21-23, 2000. All under one roof! 1500+ Attendees from all walks of the industry: brokerage firms, developers, facility managers, corporate owners & users, REITs, property managers, appraisers, lenders, settlement services firms, architects.
For more information visit www.realcomm.com
Energy Interactive Unveils Latest Version of Energy Profiler™
Oakland, California - April 24, 2000 - Energy Interactive (EI) announced today the release of Energy Profiler 3.2, the latest version of the popular energy usage and pricing analysis software. Energy Profiler is a Windows®-based tool that allows users to view and manipulate load data graphically, compare rates on the basis of bill calculations, and manage a database of pricing.
For more information visit www.energyinteractive.com
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